Multilayer Ceramic Process Capabilities

Tape Punching

• Automated
• Varible Speed

Screen Printing

• Tungsten
• Molybdenum/Manganese
• Dielectrics

Lamination

• Multilayer
• Uniaxial
• Isostatic
• Semi Isostatic

Singulation

• Hot Knife
• Dicing
• Laser
• Gang Punching

Firing

• To 2100°C
• N2/ H2/ Inert/ Vacuum
• Pushing
• Periodic
• Refractory Metal
• Air Firing

Clean Room

Plating

• In-house Electroless Nickel Plated with Immersion Gold (E-NIG), Electroless Nickel Palladium and Gold (ENEPIG), along with Nickel, Gold, Silver, Copper and Tin

Tooling

• EDN
• CNC
• Fixture Fabrication

Inspection

• Optical CMM
• XRF
• Thermal Analysis